![heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange](https://i.stack.imgur.com/4QJEq.gif)
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
![FK 244 13 D PAK | Fischer Elektronik Heat Sink D-PAK (TO-252)/D2-PAK (TO-263)/D3-PAK (TO-268)/SO-8/SO-14/SO-16/Power SO-10/SOT-223 25 K/W | Distrelec Germany FK 244 13 D PAK | Fischer Elektronik Heat Sink D-PAK (TO-252)/D2-PAK (TO-263)/D3-PAK (TO-268)/SO-8/SO-14/SO-16/Power SO-10/SOT-223 25 K/W | Distrelec Germany](https://media.distrelec.com/Web/WebShopImages/landscape_large/_t/if/ick-smd-f-4.jpg)
FK 244 13 D PAK | Fischer Elektronik Heat Sink D-PAK (TO-252)/D2-PAK (TO-263)/D3-PAK (TO-268)/SO-8/SO-14/SO-16/Power SO-10/SOT-223 25 K/W | Distrelec Germany
![Ivent Solutions Limited - SMD Heatsink for TO-263 and D2PAK devices, Tin plated Copper, 26.2mm (W) x 12.7mm (L) x 9.906mm(H), 0.6mm thickness Copper, bulk packaged,SMD Heatsink for TO-263 and D2PAK devices, Ivent Solutions Limited - SMD Heatsink for TO-263 and D2PAK devices, Tin plated Copper, 26.2mm (W) x 12.7mm (L) x 9.906mm(H), 0.6mm thickness Copper, bulk packaged,SMD Heatsink for TO-263 and D2PAK devices,](https://ivent.co.nz/images/ocw/bk-cus-0013-003-extra-large.jpg)
Ivent Solutions Limited - SMD Heatsink for TO-263 and D2PAK devices, Tin plated Copper, 26.2mm (W) x 12.7mm (L) x 9.906mm(H), 0.6mm thickness Copper, bulk packaged,SMD Heatsink for TO-263 and D2PAK devices,
![Figure 1 from A comparison of thermal vias patterns used for thermal management in power converter | Semantic Scholar Figure 1 from A comparison of thermal vias patterns used for thermal management in power converter | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/d63bb6d79ab2a9298770ebb5fa9807ace7717b3f/1-Figure1-1.png)
Figure 1 from A comparison of thermal vias patterns used for thermal management in power converter | Semantic Scholar
![Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages. Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages.](https://www.anglia.com/newsarchive/images/2373.jpg)
Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages.
![thermal - Why are these SMD heatsinks designed to not touch the IC? - Electrical Engineering Stack Exchange thermal - Why are these SMD heatsinks designed to not touch the IC? - Electrical Engineering Stack Exchange](https://i.stack.imgur.com/jPCmm.png)